Advanced thermography for in-service inspection

ThermoScope III from Thermal Wave Imaging

Portability for the field—that’s the driving force behind ThermoScope III. Combining flash heating, image acquisition and analysis, this unit allows a single user to perform the inspection with ease and simplicity. ThermoScope III uses patented MOSAIQ software with Thermographic Signal Reconstruction (TSR) processing to provide an unprecedented degree of clarity, penetration depth and resolution for applications in the field. 

Features
Simple operation with interactive display
Automatic inspection routines for on-the-spot decisions
Fast/real time inspection
Single operator / easy to use
Non-contact
Delamination
Adhesion
Water ingress
Impact damage
Foreign object debris (FOD) detection

"Thermography is particularly good for finding flaws such as a void behind the RCC silicon carbide outer layer.”

- Dr. William Winfree, NASA Scientist

Contacts

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Technical Director
+44 1372 378822
Fax: +44 1372 375353

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